7. Conclusion

The integration of capacitors (paragraph 6.2.2.2) and, more generally, of active silicon circuits can be achieved using several advanced methods which are currently being developed and introduced into production. The "embedded die" method is in fact a sum of technological adaptations. The interconnection to the integrated circuit is made via a microvia optimized to fit the integrated circuit's inputs and outputs. This optimized connection is achieved using excimer laser drilling and LDI photolithography processes.

A printed circuit board with components that used to be surface-mounted is now being developed for volume integration. This technological brick is to be added to the other bricks that are redesigning printed circuit technology today. These include the integration of optical functions or microfluidic channels... These bricks open up new perspectives and...