1. Board technologies
The most commonly used interconnection method for electronic components is the printed circuit board, on which components are assembled by soldering, gluing or direct transfer.
1.1 Multilayer printed circuit board
This is a composite material (woven glass fibers and resin) on which copper interconnection conductors are etched or printed. A higher density of interconnection per unit area has been achieved by the multi-layer technology commonly used today. This consists of a stack of sheets of organic resin-based composite material (dielectric) coated with copper (two-sided circuits), photo-etched and bonded together with a sheet of thermo-adhesive resin (prepreg) by means of temperature pressing (figure
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Board technologies
Assembly and interconnection technologies
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