1. Materials
1.1 Substrates
The same processes are used to manufacture alumina for hybrid circuits, whether as a base substrate or a multilayer substrate.
The process begins by formulating a slip comprising :
calcined alumina powder, as fine as possible;
binders and plasticizers ;
wetting and dispersing agents ;
solvents.
This slurry is ground in roller mills to ensure homogeneous mixing and calibration.
The slurry is then put into pressure tanks to feed the spreading machines, and poured onto a stainless steel or polyester belt. The whole process advances continuously...
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Materials
Final assembly of hybrid printed circuit boards
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