Final assembly of hybrid printed circuit boards
Hybrid circuits - Manufacturing
Article REF: E3927 V1
Final assembly of hybrid printed circuit boards
Hybrid circuits - Manufacturing

Authors : Augustin COELLO-VERA, Claude DREVON

Publication date: March 10, 1995 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

2. Final assembly of hybrid printed circuit boards

2.1 Components used in hybrids

The components used in hybrid circuits, as for any electronic function, can be divided into two classes: passive and active.

Passive components are either printed directly (usually resistors), or transferred in the form of blocks. These two options can be combined to overcome the specific drawbacks of each technology. For example, the use of transferred resistive blocks is possible:

  • on thin-film circuits for high-value resistors (a few tens of kiloohms and above);

  • on thick-film circuits for low temperature drifts (< 50 · 10 – 6 / °C).

All active components found on...

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Ongoing reading
Final assembly of hybrid printed circuit boards

Article included in this offer

"Electronics"

( 262 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details