Collective micro-machining technology
Microelectronic sensors
Article REF: E3093 V1
Collective micro-machining technology
Microelectronic sensors

Authors : Alfred PERMUY, Éric DONZIER, Fadhel REZGUI

Publication date: May 10, 2004, Review date: November 29, 2019 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

2. Collective micro-machining technology

2.1 General features

Structures exploiting the mechanical and elastic properties of materials are usually referred to as micromachined. They generally comprise at least one flexible element (beam, bridge or membrane) and are produced by deep chemical or physico-chemical etching (often in excess of 100 µm). The purpose of these etchings is to isolate elastic structures within a material of the same nature (usually silicon) or of a different nature (for example, creating a polysilicon beam by etching away an underlying oxide layer).

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Ongoing reading
Collective micro-machining technology

Article included in this offer

"Electronics"

( 262 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details