1. Packaging

The aim of this section is not to cover microprocessor packaging in detail, but simply to illustrate the various techniques used. Readers wishing to go into this aspect in greater depth should consult the articles and reference works

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Packaging

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Bibliography

(1) - GREIG (W.J.) - Integrated circuit packaging, assembly and interconnections - . Springer Ed. (2007).
(2) - TUMMALA (R.R.) - System on package: miniaturization of the entire system - . Mc Graw Hill Professionnal (2008)....

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