7. Plastic packaging challenges
Innovations must constantly respond to new performance requirements and new constraints (ecological, for example).
7.1 Switch to lead-free process
The RoHS directive, whose main impact on electronic boards is the disappearance of SnPb solder in favor of an alloy with a higher melting point, has seriously shaken the whole edifice built on the properties of lead alloy.
The remelting profile of the new alloy (generally tin-silver-copper, SnAgCu) requires, among other things, materials that can withstand high temperatures (up to 260°C), the reclassification of housings with regard to the risk of delamination during deferral, and modified designs to take account of the deformation of large housings.
In addition, as...
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Plastic packaging challenges
Conclusion
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