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  5. All-glass chips bonded at low temperatures: what applications?

Quizzed article | REF: IN214 V1

Materials and microfluidics. Low temperature glass bonding : new opportunities

Authors: Grégory MARCH, Anne-Claire LOUËR, Guillaume DA ROLD, Clément NANTEUIL

Publication date: October 10, 2014, Review date: October 15, 2021 | Lire en français

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    4. All-glass chips bonded at low temperatures: what applications?

    All-glass chips, sealed by low-temperature bonding, combine the advantages of all-glass chips, namely :

    • ability to perform recurring analyses ;

    • easy cleaning of fluid channels ;

    • superiority of glass for certain applications mentioned above,

      and the advantages of low-temperature bonding, notably that it does not damage any materials or nanostructures present in the chip that would be thermodegradable at temperatures above 300°C.

    As already mentioned, a marketable lab-on-a-chip must include all stages of analysis: injection, extraction, separation and detection. Low-temperature sealing makes it possible to integrate thermodegradable structures or materials that can bring improvements to each stage of analysis. Among...

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