Conclusion

Throughout this article, a description of the various constituents of a power module has highlighted the many improvements that have been made to power module packaging in recent years, to obtain power assemblies with high power density, operating at high temperatures and compatible with the RoHS standard. In particular, major advances have been made in power module assembly technologies, with the development of 3D interconnection technologies modifying power module packaging from planar integration (Wire Bonding technology) to 3D integration, and high-temperature assembly solutions that are alternative to soldering and lead-free (copper/tin, copper/indium, gold/tin, gold/indium, silver/tin or silver/indium transient phase soldering and silver sintering). However, a great deal of work remains to be done to prove the reliability and assess the service life of future power modules....