Interconnections and contact
ALD in Microelectronic. Applications, Equipments and Productivity
Research and innovation REF: RE255 V1
Interconnections and contact
ALD in Microelectronic. Applications, Equipments and Productivity

Authors : Mickael GROS-JEAN, Arnaud MANTOUX

Publication date: November 10, 2016 | Lire en français

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6. Interconnections and contact

Towards the end of the 1990s, aluminum was replaced by copper for the manufacture of metal interconnects, as the latter has a lower resistivity, allowing the electrical signal to propagate more rapidly through the circuit . Interconnections are formed by copper lines on different levels (up to 12), each level being connected by copper studs (figures

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