System damage
Analysis method for printed circuit boards subjected to environmental vibrations

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System damage


Analysis method for printed circuit boards subjected to environmental vibrations

Author : Maxime ALAY-EDDINE

Publication date: November 10, 2013, Review date: February 2, 2017 | Lire en français

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3. System damage

In this section, we'll look at the relative displacement between a board and a component assembled on it, and then see how this phenomenon can produce breaks.

3.1 Relative displacement between an electronic board and a component

Let δ be the maximum relative displacement between a component and the electronic board on which it is mounted. Figures 4 a and b show the two possible configurations, depending on whether or not the component is centered on the board.

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