Conclusion
Heat dissipation in electronic systems
Archive REF: E3952 V2
Conclusion
Heat dissipation in electronic systems

Author : Jean-Pierre PETIT

Publication date: February 10, 2001, Review date: May 17, 2019 | Lire en français

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5. Conclusion

The miniaturization of electronic equipment is leading to very high flux densities, with junction temperatures having to be kept at ever-lower levels: this is an arduous problem. In high-power devices such as supercomputers, the equipment is immersed directly in fluids such as freon. Fluid cooling is now well developed, but air cooling is still important because it's easy to use. It concerns the vast majority of industrially-produced electronic equipment.

.Component-board coupling
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