Thermal characteristics of components
Heat dissipation in electronic systems
Archive REF: E3952 V2
Thermal characteristics of components
Heat dissipation in electronic systems

Author : Jean-Pierre PETIT

Publication date: February 10, 2001, Review date: May 17, 2019 | Lire en français

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2. Thermal characteristics of components

The components are classified into three main families:

  • semiconductor components 2.1 : transistors, diodes, thyristors, logic or analog integrated circuits... ;

  • passive components 2.2 : resistors, conductances, inductors... ;

  • ...

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