Transfer devices
Heat dissipation in electronic systems
Archive REF: E3952 V2
Transfer devices
Heat dissipation in electronic systems

Author : Jean-Pierre PETIT

Publication date: February 10, 2001, Review date: May 17, 2019 | Lire en français

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3. Transfer devices

The thermal power generated at the junction is conducted through the component and structures by conduction. This conduction can be improved by using materials that are good conductors of heat, such as copper, hence the use of thermal drains. If the power to be dissipated is very high, more efficient systems are used, such as heat pipes 3.1 and thermoelectric modules 3.2

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