5. Thermal design guide

5.1 Specificity of hybrid circuits

The reduction in the volume of electronics due to miniaturization – including the use of hybrid circuits – results in an increase in thermal density and limits thermal evacuation possibilities.

When designing a hybrid circuit, it is necessary to carry out a thermal analysis to ensure that the junction temperature of active pads and the package temperature of other microcomponents are not exceeded.

A few basic rules must be taken into account when designing a dissipative hybrid circuit:

• distribute power sources over the entire substrate to avoid hot spots and keep the thermal profile as uniform as possible;

• position dissipative...