Assembly reliability
Integrated Circuits packaging
Article REF: E3400 V3
Assembly reliability
Integrated Circuits packaging

Author : Jean-Luc DIOT

Publication date: September 10, 2024 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

7. Assembly reliability

The reliability of an object is assessed by the length of time it fulfills the function for which it was built. The level of reliability required by an electronic assembly obviously depends on the field of application.

Example:

We'll put up with the failure of a TV set, but the failure of a pacemaker can have tragic consequences. In the IT sector, the loss of data (or availability) can have extremely serious financial consequences.

As a result, methods for assessing package reliability vary widely. Without going into the theoretical concepts, described in the article [E 1 420] , let's recall that reliability calculations call on statistical methods, and make it possible to predict the life...

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Article included in this offer

"Electronics"

( 262 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details