Packaging and interconnection processes for electronics components

The penetration of electronics in virtually every segment of society (communications, transportation, education, agriculture, entertainment, healthcare, environmental controls, research and defense) is contributing to the acceleration of technological processes for making components and, consequently, their integration. Meeting the diversity of demand, at lower cost and with better performance, is impossible without major changes in the architecture, materials and packaging processes of electronic components and modules. These new packaging technologies are called "system-in-package", "wafer level packaging", "3D integration", "through silicon vias" and "interposers". As the need for components continues to grow, two major trends must be addressed: firstly, the reduction in the size of electronic components ("more Moore"), and secondly, the increase in functionality ("more than Moore"). To achieve this, innovation requires the development of new technologies, the emergence of new levels of integration, the extension of existing technologies to new applications and, of course, the evolution of electronic components.

A glossary and table of acronyms are presented at the end of the article, and readers are invited to refer to them as they read on.