Background and challenges
Integrated Circuits packaging
Article REF: E3400 V3
Background and challenges
Integrated Circuits packaging

Author : Jean-Luc DIOT

Publication date: September 10, 2024 | Lire en français

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1. Background and challenges

1.1 The role of packaging

Microelectronic chip packaging establishes the interconnections and environment required by integrated circuits to process or store information. In fact, it corresponds to the first packaging level of a conventional microelectronic system. For further information, please refer to [E 3 401] . Packaging involves a number of scientific and technical skills, including :

  • electronics, which...

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