8. Conclusion

Plastic packaging for integrated circuits has become indispensable, thanks to its price/integration/automation advantages and its ability to adapt to ever-changing equipment requirements. For a long time to come, there will continue to be applications that justify the use of simple, robust housings. But, just as the development of modern components can no longer dissociate chip and encapsulation design, the development of equipment is increasingly blending package and printed circuit board technologies to the point where it is no longer possible to distinguish where the boundaries lie.