Article | REF: E3405 V1

Plastic packaging

Author: Charles LE COZ

Publication date: May 10, 2009, Review date: May 17, 2019 | Lire en français

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    5. Related solutions

    In order to establish itself, plastic encapsulation has had to find solutions to each of the shortcomings listed in chapter . The manufacture of the semiconductor chip itself was transformed.

    5.1 Chip passivation

    The first step in countering circuit corrosion was to improve the semiconductor's protective, or passivation, layers. The most commonly used materials are silica and silicon nitride, deposited in thin layers (of the order of μm). Passivation takes place at the end of wafer manufacturing. The metallized areas used to wire the interconnection wires are not covered by the protection (figure ).

    The quality of the passivation is also an important parameter of the protection provided: a lack of integrity...

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