2. Thermomechanical fatigue of brazed joints
2.1 Behavior of electronic assemblies during thermal cycles
The so-called "thermomechanical" fatigue of brazed joints corresponds to LCF (Low Cycle Fatigue) fatigue, characterized by high stress amplitudes and low stress frequencies. This is typically the type of loading encountered during temperature variations. It must be distinguished from polycyclic fatigue or HCF (High Cycle Fatigue), characterized by low stress amplitudes but high stress frequencies, as can be the case for electronic assemblies subjected to vibrations. There is also a VLCF (Very Low Cycle Fatigue) regime, which corresponds to overloads that can occur, for example, during shocks or falls in portable applications. Figure
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed? Log in!
Thermomechanical fatigue of brazed joints
Input data for calculating the thermomechanical lifetime of solders
Article included in this offer
"Electronics"
(
263 articles
)
Updated and enriched with articles validated by our scientific committees
A set of exclusive tools to complement the resources
Bibliography
- (1) - VELDHUIJZEN VAN ZANTEN (J.F.J.), SCHUERINK (G.A.), TULLEMANS (A.H.J.), LEGTENBERG (R.), WITS (W. W.) - Method to determine thermoelastic material properties of constituent and copper-patterned layers of multilayer printed circuit boards. - In : Journal of Materials Science : Materials in Electronics,...
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed? Log in!
