5. Thermomechanical lifetime models
5.1 Statistical analysis of lifetime data using the two-parameter Weibull distribution
Accelerated thermal cycling tests are used to measure the number of cycles to failure for different types of electronic assemblies. A large number of identical configurations (i.e., same component, same PCB, same solder, and same thermal cycling conditions) must be tested in order to perform statistical post-processing of the experimental results in terms of thermomechanical lifetime. The IPC-9701 standard, for example, recommends a sample size of 32.
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Thermomechanical lifetime models
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- (1) - VELDHUIJZEN VAN ZANTEN (J.F.J.), SCHUERINK (G.A.), TULLEMANS (A.H.J.), LEGTENBERG (R.), WITS (W. W.) - Method to determine thermoelastic material properties of constituent and copper-patterned layers of multilayer printed circuit boards. - In : Journal of Materials Science : Materials in Electronics, vol. 29, p. 4900-4914 (2018)....
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