Thermomechanical fatigue of brazed joints
Thermomechanical durability of lead-free electronic assemblies
Article REF: E3956 V1
Thermomechanical fatigue of brazed joints
Thermomechanical durability of lead-free electronic assemblies

Author : Jean-Baptiste LIBOT

Publication date: February 10, 2026 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

2. Thermomechanical fatigue of brazed joints

2.1 Behavior of electronic assemblies during thermal cycles

The so-called "thermomechanical" fatigue of brazed joints corresponds to LCF (Low Cycle Fatigue) fatigue, characterized by high stress amplitudes and low stress frequencies. This is typically the type of loading encountered during temperature variations. It must be distinguished from polycyclic fatigue or HCF (High Cycle Fatigue), characterized by low stress amplitudes but high stress frequencies, as can be the case for electronic assemblies subjected to vibrations. There is also a VLCF (Very Low Cycle Fatigue) regime, which corresponds to overloads that can occur, for example, during shocks or falls in portable applications. Figure

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Article included in this offer

"Electronics"

( 262 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details