Input data for calculating the thermomechanical lifetime of solders
Thermomechanical durability of lead-free electronic assemblies
Article REF: E3956 V1
Input data for calculating the thermomechanical lifetime of solders
Thermomechanical durability of lead-free electronic assemblies

Author : Jean-Baptiste LIBOT

Publication date: February 10, 2026 | Lire en français

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3. Input data for calculating the thermomechanical lifetime of solders

The previous section highlighted the paramount importance of input data in estimating fatigue criteria and, ultimately, in assessing the thermomechanical durability of brazed joints. The purpose of this section is to further analyze these various input data by presenting the methodological basis for evaluating them, accompanied by a few examples. It should be noted that, in this section and thereafter, the brazing composition considered will be the lead-free alloy 96.5Sn-3.0Ag-0.5Cu (SAC305).

3.1 Material properties of printed circuit boards and electronic components

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Input data for calculating the thermomechanical lifetime of solders

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