1. General

The reader found in the article All the general information on thin films used in electronic functions: definitions, fields of application, types of components produced, materials and their characteristics.

This article focuses on recent interconnection applications known as multichip modules, as well as recent developments in optoelectronics and three-dimensional packaging.

With the advent of complex digital techniques, large components (some with more than 1,000 interconnections), miniaturization needs, flip-chip or CSP-based assembly techniques, and speed requirements, thin-film interconnection is certainly regaining interest.

The originality of...