3. Interconnection technologies
Despite the availability of optoelectronic sources and interfaces on the market, more than half the development costs of interconnection modules are due to the assembly and encapsulation stages. A module can be broken down into two parts: the so-called passive technologies (at the electrical level), which include assembly and encapsulation as well as coupling optics, if any, and the active technologies, made up of optoelectronic interfaces.
3.1 Passive technologies
They include everything to do with the assembly and encapsulation of the module's various components. Traditionally, optoelectronic components are dynamically transferred, i.e. the assembly of the fibers facing the sources or photodetectors is adjusted in real time by controlling the coupled optical...
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Interconnection technologies
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