5. ALD applications

The ALD deposition process, thanks to its ability to form dense, covering layers of material of controlled thickness, with precise control of stoichiometry, whatever the type of substrate (smooth, rough, nanostructured, complex geometry, 3D structures, polymer...) at relatively low temperatures (generally below 300°C), is used in a wide range of applications . Precise control of film thickness also makes it possible to develop new strategies for modifying...