Post-processing
Copper electroless and electrodeposition of copper in acidic media
Article REF: M1605 V2
Post-processing
Copper electroless and electrodeposition of copper in acidic media

Author : Hassine Ferid AYEDI

Publication date: September 10, 2016 | Lire en français

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5. Post-processing

Post-treatment of solid copper or copper cladding can be decorative (coloring, patinas) or technical (protection of the manufactured object).

  • Until the last decade, the technical purpose of post-treatment of copper coatings was to provide temporary protection against part degradation, using passivates based on hexavalent chromium or copper corrosion inhibitors (benzotriazole). Today's functional post-treatments concern the industrial sector of printed circuit boards with, for example, the application of organometallic conversion coatings or coatings containing compounds with a cationic group - C = N + [US 005 85 8074A].

    One such process involves forming a copper(II)-based organometallic conversion on the copper coating of a printed circuit board, then converting said layer...

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