5. Glossary
BEOL; BEOL (Back-End Of Line)
Industrial steps in the fabrication of interconnects.
Mushrooming
Localized isotropic growth leading to the formation of a mushroom-shaped structure.
Encapsulation; capping
A thin layer used to protect the properties of the underlying material.
SAV/FSAV; Self-Aligned Vias / Fully Self-Aligned Vias
Self-aligned filling of contact holes.
Material overhang
Material extending beyond the boundary in one spatial direction.
Pinholes
A defect (hole) sometimes observed during the growth of a thin film.
Vias; vias
Contact holes used for interconnections.
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