7. Application to a chip-scale package (CSP)
7.1 Introduction
In mechatronic devices, the finite element method (FEM) is used to determine the fatigue response of solder joints under thermal loading. These lifetime analyses are often deterministic. However, experience shows that design variables have a variability and randomness that affect the quality of predictions. These uncertainties are an inherent feature of nature and cannot be avoided. This section describes a method for predicting the reliability of solder joints in Tape-Chip Scale Packaging (T-CSP) electronic packages, which takes into account uncertainties in material properties. The approach, which is based on metamodeling techniques, combines finite element method (FEM) simulation, metamodels and Monte-Carlo simulation (MCS). Once the constructed metamodel has been...
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Application to a chip-scale package (CSP)
Metamodel-based uncertainty analysis for the micro-pump
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