Design
Modules and power packages (packaging)
Article REF: D3116 V1
Design
Modules and power packages (packaging)

Author : Cyril BUTTAY

Publication date: May 10, 2010 | Lire en français

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5. Design

From an electrical and thermal point of view, the design of a package is not fundamentally different from that of a power electronics system: it's always a question of minimizing parasitic inductances and resistances, finding the best solution for cooling the chips, and so on. That's why we'll just touch on the subject here.

Nota

the reader is referred to the :

– PEEC modeling of connections in power converters [D 3 071] ;

– Heat dissipation in electronic systems

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