The role of packaging
Modules and power packages (packaging)
Article REF: D3116 V1
The role of packaging
Modules and power packages (packaging)

Author : Cyril BUTTAY

Publication date: May 10, 2010 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

1. The role of packaging

If the semiconductor chip is the "heart" of an active power component, it cannot function independently of its case or, in a broader sense, its packaging. It is this packaging that protects and isolates it from its environment, dissipates the heat it dissipates, and provides connection terminals with the rest of the circuit.

1.1 Mechanical strength

The primary role of a power component housing is protection: semiconductor chips are highly sensitive to humidity, dust and static electricity (particularly in the case of insulated-gate MOSFET and IGBT components). This protection is provided mechanically by a closed enclosure (made of plastic, ceramic or metal) preventing the entry of foreign bodies.

The housing also provides the means (screwing,...

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Article included in this offer

"Conversion of electrical energy"

( 273 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details