Article | REF: D3116 V1

Modules and power packages (packaging)

Author: Cyril BUTTAY

Publication date: May 10, 2010 | Lire en français

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    1. The role of packaging

    If the semiconductor chip is the "heart" of an active power component, it cannot function independently of its case or, in a broader sense, its packaging. It is this packaging that protects and isolates it from its environment, dissipates the heat it dissipates, and provides connection terminals with the rest of the circuit.

    1.1 Mechanical strength

    The primary role of a power component housing is protection: semiconductor chips are highly sensitive to humidity, dust and static electricity (particularly in the case of insulated-gate MOSFET and IGBT components). This protection is provided mechanically by a closed enclosure (made of plastic, ceramic or metal) preventing the entry of foreign bodies.

    The housing also provides the means (screwing,...

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