Assembly methods for metal parts
Assembly methods for microwave tubes and devices

Add to my library

E3420 V1 Archive

Assembly methods for metal parts


Assembly methods for microwave tubes and devices

Authors : Dominique DIEUMEGARD, Gérard LE CLOAREC

Publication date: August 10, 2004, Review date: September 25, 2020 | Lire en français

Add to my library Add to my library

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

2. Assembly methods for metal parts

2.1 Brazing

Brazing is a joining process in which a molten filler metal or filler alloy is pressed between two parts to be joined, which remain in a solid state during the operation (for the sake of brevity, the term "filler metal" may also be used to refer to a filler alloy).

Penetration is only successful if the filler metal wets the parts to be brazed sufficiently, i.e. if the wetting angle between these elements is small; this implies that they partially combine to form a solid solution or intermetallic compound. A filler metal must therefore be carefully selected, from among the possible materials, according to its melting temperature and its ability to form alloys with the elements to be brazed, and this independently...

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Article included in this offer

"Electronics"

( 263 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details

Dans les ressources documentaires

Circuits passifs hyperfréquences - Éléments non réciproques à ferrite

Les circuits passifs non réciproques sont très utilisés dans le domaine des radars et des télécommunicati...

Céramiques pour composants électroniques

Nombre de fonctions électroniques « passives » sont assurées par des composants réalisés par la technolog...

Céramiques transparentes - Caractéristiques générales et procédés de fabrication

Cet article est consacré aux céramiques transparentes. Cette famille de céramiques techniques fonctionnel...

Dispositifs HEMT à base de GaN - Matériaux et épitaxie

Dans le domaine de la microélectronique de puissance hyperfréquence, le matériau à grand gap GaN constitu...

Tous les livres blancs
Toutes les actualités
Contact us