6. Glossary
Planar technology
Process for implementing circuits on flat substrates. Lines are deposited or etched on the substrate surface. In the multilayer case, different substrates are stacked and the lines deposited on the interfaces can be connected by metallized holes (vias). The structure may or may not have a metal base.
Métallisation; metallization
Process for adding metal to or through substrates. Examples include electroplating, copper foil bonding (heating and pressing lamination), sputtering and painting (on foam substrates, for example).
Screen printing
The process consists in mechanically spreading dielectric pastes or conductor inks in a planar geometry that can be multilayered. Each layer is baked at 900°C.
Screen printing; thin-film...
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