3. Manufacturing and integration with CMOS technology (BiCMOS)
The information presented in this section supplements that presented in paragraph 2 of article
3.1 BiCMOS integration issues and challenges
The main advantage of the Si/SiGe TBH is not only its compatibility, but also its filiation with silicon technologies, making it possible to integrate it with CMOS technologies. This bipolar/CMOS cointegration is not easy, however, since the manufacture of a Si/SiGe TBH can influence the performance of CMOS transistors, and vice versa.
Some of the main constraints are listed below:
the manufacturing thermal budget,...
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Manufacturing and integration with CMOS technology (BiCMOS)
Integrated circuit applications
Bibliography
Events
Conference: IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).
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