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Saverio LEROSE: Doctor of Materials Science - Electronics Development Engineering Manager - Thales Corporate Engineering, Vélizy, France
INTRODUCTION
As electronic products and systems become ever more demanding in terms of performance and compactness, designers are increasingly turning to digital electronics, which are becoming faster and more mixed with analog and RF electronics. This trend has led to the emergence of a new discipline in electronic board design, Signal Integrity (SI), whose aim is to guarantee compatibility between board components in terms of their signal exchange, taking into account the characteristics of the printed circuit boards.
In addition, the board's operation can be affected by the ambient electromagnetic environment, which can sometimes make the board a source of parasitic radiation. As a result, a board's ElectroMagnetic Compatibility (EMC) must be taken into account by its designer, who must comply not only with functional requirements, but also with standardized requirements in terms of electromagnetic emission and susceptibility, the latter sometimes being subject to strict regulations such as CE marking in Europe (EMC directive).
The two disciplines, signal integrity and EMC, are by no means separate, and there's a strong natural bond between them. Mastered and controlled signal integrity inevitably improves the EMC characteristics of the board and, consequently, those of the product incorporating the board.
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Signal integrity and electromagnetic compatibility (EMC) of electronic boards
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