Ferroelectric Memory (FeRAM)
ALD in Microelectronics devices - Evolution and Use in Advanced Micro-Devices

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RE255 V2 Article

Ferroelectric Memory (FeRAM)
ALD in Microelectronics devices - Evolution and Use in Advanced Micro-Devices

Authors : Rémy GASSILLOUD, Messaoud BEDJAOUI

Publication date: September 10, 2026 | Lire en français

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2. Ferroelectric Memory (FeRAM)

Ferroelectric memories represent a breakthrough in the field of storage technologies. They combine non-volatility, speed, and low power consumption. They utilize the remanent polarization of ferroelectric materials (e.g., PZT, Hf0.5Zr0.5O2) to store binary data, offering a promising technology to replace traditional flash memory. There are several types and architectures of ferroelectric memories, which combine a ferroelectric layer with a read/write circuit, typically in a 1T1C (1 transistor/1 ferroelectric capacitor) architecture. We are also seeing the gradual integration of ferroelectric materials into hyper-dense DRAM (Dynamic Random Access Memory) stacks.

ALD has become indispensable for filling high-aspect-ratio trenches in DRAM applications. In most cases (except for a few known as FeFETs), the memory cell consists of a metal/insulator/metal (MIM) stack...

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