Article | REF: NM610 V1

Radiofrequency cathodic sputtering deposition of nanometric films

Author: Gilles RENOU

Publication date: April 10, 2006 | Lire en français

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    3. Deposit settings

    3.1 Spraying mechanisms

    A fairly broad definition of sputtering is "the erosion of a material's surface at the atomic scale under the impact of a particle." The particles emitted are mainly neutral in their ground state, but ionic compounds such as fluorides and chlorides mainly emit ions. Finally, in some cases, clusters (sometimes of surprising size) may also be emitted. In our case, in low-pressure RF plasma, sputtering is the emission of neutral or charged atoms from the target under the action of ion bombardment. This ejection results from the transfer of energy between the incident ions and the atoms constituting the target.

    The two most common sequences in our configuration are as follows:

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