Assembly reliability
Integrated Circuits packaging

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E3400 V3 Article

Assembly reliability


Integrated Circuits packaging

Author : Jean-Luc DIOT

Publication date: September 10, 2024 | Lire en français

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7. Assembly reliability

The reliability of an object is assessed by the length of time it fulfills the function for which it was built. The level of reliability required by an electronic assembly obviously depends on the field of application.

Example:

We'll put up with the failure of a TV set, but the failure of a pacemaker can have tragic consequences. In the IT sector, the loss of data (or availability) can have extremely serious financial consequences.

As a result, methods for assessing package reliability vary widely. Without going into the theoretical concepts, described in the article [E 1 420] , let's recall that reliability calculations call on statistical methods, and make it possible to predict the life...

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