9. Glossary
ball
Bille.
bossages; bumps
A deposit that allows contact to be made with a ball.
bumping
Bossing.
chip ; die
Chip.
flip chip
Flip chip.
interpose
Intermediate chip used as a mechanical wedge or which can accommodate chips on either side and is fitted with through-holes.
electronic module
Several electronic components interconnected and assembled.
pillar bumps
Interconnections often surmounted by fusible material (usually copper) to ensure soldering.
remelting
Technical...
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed? Log in!
Glossary
Acronyms and symbols
Article included in this offer
"Electronics"
(
263 articles
)
Updated and enriched with articles validated by our scientific committees
A set of exclusive tools to complement the resources
Bibliography
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed? Log in!
