9. 3D interconnection technologies

Current research in power electronics aims to increase the power density of power modules. This means creating more compact modules, integrating large-gap components and optimizing electrical, thermal and mechanical performance. This has a direct impact on packaging. Some of today's mature technologies (such as Wire Bonding) are unable to meet these new requirements. Their limitations, mentioned earlier in this article, are blocking or even contradictory to an increase in power density. To meet these new requirements, we therefore need to resort to 3D integration without cabling wires (figure 24 ). The use of the third dimension makes it possible to improve electrical properties (electrical resistance, parasitic inductances) and thermal properties (double-sided...