8. Encapsulation

The encapsulation of a power module contributes to meeting the mechanical and chemical protection requirements of packaging. Its purpose is to ensure the power module's dielectric strength, and to protect the semiconductor chips and assembly from external aggression (humidity, contamination, etc.). It also reinforces electrical insulation between conductors, and improves resistance to partial discharges caused by defects in the metallization of DBC-type substrates. It is designed in two parts (figure