3. Substrates

The substrate is located between the semiconductor chips and the base plate (figure 1 ). It integrates conductive tracks and ensures the interconnection of the power module's electronic components, their mechanical assembly, their electrical insulation and must facilitate the extraction of the heat they dissipate towards the heat sink. Finally, from a thermomechanical point of view, its role is to homogenize the coefficients of thermal expansion (CTE) between the base plate and the chips. Electrical insulation is provided by organic dielectrics or ceramics.

The different types of substrates used in power electronics can be grouped into three categories and are each described...