ALD Technology for Encapsulation
Environmental barriers by ALD

Before the advent of ALD, barrier layers were primarily fabricated using physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel methods, or by applying polymer or metal layers. These techniques are still suitable for less demanding applications, but the demand for higher-performance barriers on complex architectures and sensitive substrates has led to the adoption of ALD.

Thanks to these self-limiting surface reactions, ALD produces dense, uniform, and continuous films containing a low number of intrinsic through-hole defects known as pinholes. Compared to other commonly used deposition techniques, ALD enables the fabrication of thinner films with superior barrier performance. ALD deposition can also be performed at low temperatures, a...