Conclusion
Environmental barriers by ALD

ALD is emerging as a key technology for the encapsulation of sensitive devices, offering solutions tailored to increasingly stringent gas barrier requirements. Thanks to its nanometer-scale precision, its ability to conform to complex substrates, and its compatibility with temperature-sensitive materials, ALD enables performance levels up to ultra-high barrier (UHB). However, its industrial deployment still faces major challenges, particularly in terms of deposition rate, mechanical stability under stress, and resistance to aggressive environments (humidity, pollutants). Inorganic/organic nanolaminates are proving particularly promising for balancing barrier performance, flexibility, and durability. Recent advances in ALD processes are also paving the way for large-scale industrialization, particularly for applications such as food packaging and flexible electronic devices. Finally, the examples presented...