Bibliographie
Du micro vers le nano-emboutissage à chaud : développements

RéférencesHECKELE (M.)SCHOMBURG (W.K.)Review on Micro Molding of Thermoplastic Polymers. Journal of Micromechanics and Microengineering, 14, R1-R14 (2004).DITTRICH (H.)HECKELE (M.)MEHNE (C.)Double Sided Large Area Hot Embossing for Polymer Microstructures with High Aspect Ration. HARMST05, Gyeongju, Korea, S.226-227 (2005).WALLRABE (U.)DITTRICH (H.)FRIEDSAM (G.)HANEMANN (Th.)MOHR (J.)MÜLLER (K.)PIOTTER (V.)RUTHER (P.)SCHALLER (T.)ZIßLER (W.)Micromolded easy-assembly multi fiber connector : RibCon. Microsystem Technologies, 8, 83-87 (2002).HANEMANN (Th.)HECKELE (M.)PIOTTER (V.)Current Status of Micromolding Technology. Polymer News, vol. 25, n^o 7, pp. 224-229 (2000).RABUS (D.)HENZI (P.)MOHR (J.)Photonic Integrated Circuits by DUV-Induced Modification of Polymers. IEEE Photonics Technology Letters, 17(3), p. 591-593 (2005).HECKELE (M.)ANNA (F.)Hot Embossing of Microstructures...