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Article | REF: D3126 V1

Component fatigue in power electronics

Authors: Mounira BOUARROUDJ-BERKANI, Laurent DUPONT

Publication date: November 10, 2010 | Lire en français

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    2. Integration technologies for power electronics

    Power component assembly refers to the structure and technological processes used to interconnect one or more power chips in order to perform an electrical energy conversion function (chopper, inverter, etc.). Generally speaking, power integration is presented in three sub-assemblies:

    • level 1: active elements (semiconductors) ;

    • level 2: assembly ;

    • level 3: device protection.

    Figure 3 shows the main parts of a power component:

    • the first level is made up of chips, generally silicon-based, which represent the active part...

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