Module life under thermal stress
Component fatigue in power electronics
Article REF: D3126 V1
Module life under thermal stress
Component fatigue in power electronics

Authors : Mounira BOUARROUDJ-BERKANI, Laurent DUPONT

Publication date: November 10, 2010 | Lire en français

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5. Module life under thermal stress

5.1 Reliability and limitations in the field of power integration

In the broad context of system dependability, the Association française de normalisation (AFNOR) expresses reliability in the following terms: "Reliability is the characteristic of a device expressed by the probability that the device will perform a required function under conditions of use and for a specified period of time". Having become one of the key parameters in response to strong industrial demand, reliability is now associated with related notions such as availability, maintainability, product operating safety and security

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