4. Conclusion
The greatest difficulty in composite design is due to the absence of shielding and metal for equipotentiality of the references.
As the electromagnetic compatibility constraints are the same, adaptations are already necessary to the electronic board.
Other concerns arise in composite environments, such as complicated heat dissipation.
New components have recently appeared, such as composite connectors made conductive by deposition or conductive paint. However, experience with these technologies is still limited.
In the aeronautics sector, research is currently moving in the direction of composite casings for equipment.
In cases where metallization of the casing is impossible, then on-board shielding remains a good solution. This type of on-board shielding is widely...
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