Assembly processes
Integrated Circuits packaging
Archive REF: E3400 V2
Assembly processes
Integrated Circuits packaging

Author : Jean-Luc DIOT

Publication date: August 10, 2017 | Lire en français

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2. Assembly processes

To design and produce an electronic assembly, the specialist needs both interconnection supports and assembly processes. It is the combination of interconnection media and assembly processes that guarantees the final result and the best compromise between the many, often contradictory, constraints that an electronic assembly must meet. When designing an electronic assembly, all these constraints must be taken into account in a uniform manner.

In this chapter, we describe the main stages in the assembly of an integrated circuit chip on an interconnection support (§ 3

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